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Wire Bonding/AuSn Soldering Mount Chip Multilayer Ceramic Capacitors for General Purpose
These capacitors have gold-plated electrodes and are designed specifically for wire bonding and use of gold-tin (AuSn) solder.
- Designed specifically for wire bonding and use of gold-tin (AuSn) solder
The gold-plated external electrodes make these devices suitable for wire bonding or use of gold tin (AuSn) solder.
※This product is suitable only for wire bonding or use of gold-tin (AuSn) solder. Other mounting methods should not be used.
- Ideal for mounting in packages, such as optical communication related devices , IC and etc.
Noise can be reduced by eliminating the routing of the wire, and high efficiency can be achieved with a built-in capacitor in the package, such as TO-CAN, IC and etc. by wire bonding mounting.
- Contributes to the miniaturization of the set.
- Murata offers a lineup of small size products, such as the 0603 (0201) and 1005 (0402) in mm (inch).