CeramicCapacitorGMD Series

  • Complied with RoHS
  • REACH
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Wire Bonding/AuSn Soldering Mount Chip Multilayer Ceramic Capacitors for Consumer Electronics & Industrial Equipment

These capacitors have gold-plated electrodes and are designed specifically for wire bonding and use of gold-tin (AuSn) solder.

Specific Applications

For the detail of specific applications, please refer to the following links or specification sheets.
Specific Applications Details
Precautions for use

Consumer equipment Industrial equipment Automotive infotainment/comfort equipment Automotive powertrain/safety equipment Medical equipment [GHTF A/B/C]
except for implant equipment
Implanted medical equipment or medical equipment [GHTF D]

Features

1. Designed specifically for wire bonding and use of gold-tin (AuSn) solder

The gold-plated external electrodes make these devices suitable for wire bonding or use of gold tin (AuSn) solder.

  • Example of Structure Mounting Example
  • Example of Structure Mounting Example2

※This product is suitable only for wire bonding or use of gold-tin (AuSn) solder. Other mounting methods should not be used.

2. Ideal for mounting in packages, such as optical communication related devices , IC and etc.

Noise can be reduced by eliminating the routing of the wire, and high efficiency can be achieved with a built-in capacitor in the package, such as TO-CAN, IC and etc. by wire bonding mounting.

3. Contributes to the miniaturization of the set.

Murata offers a lineup of small size products, such as the 0603 (0201) and 1005 (0402) in mm (inch).

Specifications

Size(mm) 0.6x0.3mm - 1.0x0.5mm
Rated Voltage 6.3Vdc - 50Vdc
Capacitance 100pF - 1.0μF
Main applications Various device related,such as GaAsIC (mounted in IC packages)

Lineup

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