CeramicCapacitorGMA Series

  • Complied with RoHS
  • REACH
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Wire Bonding Mount Multilayer Microchip Capacitors for Consumer Electronics & Industrial Equipment

These capacitors have gold-plated electrodes and are designed specifically for wire bonding.

Specific Applications

For the detail of specific applications, please refer to the following links or specification sheets.
Specific Applications Details
Precautions for use

Consumer equipment Industrial equipment Automotive infotainment/comfort equipment Automotive powertrain/safety equipment Medical equipment [GHTF A/B/C]
except for implant equipment
Implanted medical equipment or medical equipment [GHTF D]

Features

1. Allows for high density mounting.

Noise can be reduced by eliminating the routing of the wire, and high efficiency can be achieved with a built-in capacitor in a package, such as IC. Miniaturization of the set is also possible.

  • Structure of wire bondable vertical electrode MLCC. Its outermost layers of terminations are Au (gold) plated. It can be mounted between Vcc line (connected to bare chip) and ground line inside densely packed IC packages by wire bonding. 1
  • Structure of wire bondable vertical electrode MLCC. Its outermost layers of terminations are Au (gold) plated. It can be mounted between Vcc line (connected to bare chip) and ground line inside densely packed IC packages by wire bonding. 2

2. Achieved small size and high capacitance with a multilayer structure.

3. Ideal for bypass applications

Especially for optical communication related devices such as TOSA/ROSA.

4. Excellent in high frequency characteristics.

Since the capacitor consists of an upper/lower electrode structure, the current path becomes shorter and lowers the ESL. Compared with the general purposeGRM series of the same capacity, the impedance of this product becomes lower at high frequencies.

Impedance-frequency characteristic chart of wire bondable vertical electrode MLCC compared with general MLCC

Specifications

Size(mm) 0.38x0.38mm - 0.8x0.8mm
Rated Voltage 6.3Vdc - 100Vdc
Capacitance 100pF - 0.47μF
Main applications 1. Optical communication related devices such as TOSA/ROSA
2. Mounted in IC packages

Lineup

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